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tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 1 toshiba led lamps tlrh1106(t11), tlrmh1106(t11), tlsh1106(t11), tloh1106(t11), tlyh1106(t11) , tlgh1106(t11) panel circuit indicator ? surface-mount devices ? 3.2 (l) 2.8 (w) 1.9 (h) mm ? flat-top type ? ingaa ? p leds ? high luminous intensity ? low drive current, high-i ntensity light emission ? colors: red, orange, yellow, green ? pb-free reflow soldering is possible ? applications: automotive use, message signboards, backlighting etc. ? standard embossed tape packing: t11 (2000/reel) 8-mm tape reel color and material unit: mm jedec D jeita D toshiba 4-3t1 weight: 0.035 g (typ.) product name color material tlrh1106 red tlrmh1106 red tlsh1106 red tloh1106 orange tlyh1106 yellow tlgh1106 green ingaa ? p
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 2 maximum ratings (ta = 25c) product name forward current i f (ma) please see note 1 reverse voltage v r (v) power dissipation p d (mw) operation temperature t opr (c) storage temperature t stg (c) tlrh1106 tlrmh1106 tlsh1106 tloh1106 tlyh1106 tlgh1106 70 4 175 ? 40~100 ? 40~100 note 1: forward current derating electrical characteristics (ta = 25c) forward voltage v f reverse current i r product name min typ. max i f max v r tlrh1106 1.8 2.1 2.5 tlrmh1106 1.8 2.1 2.5 tlsh1106 1.8 2.2 2.5 tloh1106 1.8 2.2 2.5 tlyh1106 1.8 2.2 2.5 tlgh1106 1.8 2.2 2.5 50 10 4 unit v ma a v allowable forward current i f (ma) ambient temperature ta (c) ) i f ? ta 0 0 20 40 60 80 100 120 80 100 20 40 60
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 3 optical characteristics?1 (ta = 25c) luminous intensity i v product name min typ. max i f available iv rank please see note 2 tlrh1106 160 380 800 50 sa / ta / ua tlrmh1106 160 380 800 50 sa / ta / ua tlsh1106 250 500 1250 50 ta / ua / va tloh1106 250 600 1250 50 ta / ua / va tlyh1106 250 450 1250 50 ta / ua / va tlgh1106 100 200 500 50 ra / sa / ta unit mcd mcd mcd ma note 2: the specification on t he above table is used for iv classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of eac h rank be unquestioned. luminous intensity i v rank min max ra 100 200 sa 160 320 ta 250 500 ua 400 800 va 630 1250 unit mcd mcd optical characteristics?2 (ta = 25c) emission spectrum peak emission wavelength p ? dominant wavelength d product name min typ. max typ. min typ. max i f tlrh1106 ? 644 ? 18 624 630 638 tlrmh1106 ? 636 ? 17 620 626 634 tlsh1106 ? 623 ? 17 607 613 621 tloh1106 ? 612 ? 15 599 605 613 tlyh1106 ? 590 ? 15 581 587 595 tlgh1106 ? 574 ? 11 565 571 576 50 unit nm nm nm ma the cautions ? this visible led lamp also emits some ir light if a photodetector is located near the led lamp, please ensure that it will not be affected by the ir light. ? this product is designed as a general display light sou rce usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. ther efore, it is not intended for usage of functional application (ex. light source for sensor , optical communi cation and etc) except general display light source.
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 4 tlrh1106 relative luminous intensity i f ? v f forward current i f (ma) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 forward voltage v f (v) forward current i f (ma) i v ? i f luminous intensity i v (mcd) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 0 580 620 640 660 700 0.2 0.4 0.6 0.8 1.0 i f = 50 ma ta = 25c 600 680 1 1 10 100 100 100 10 30 3 300 3 30 ( t yp . ) ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . )
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 5 tlrmh1106 ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 100 100 10 30 3 300 3 30 0 0.5 3 0.3 ? 20 0 20 40 60 80 1 0 580 620 640 660 700 0.2 0.4 0.6 0.8 1.0 i f = 50 ma ta = 25c 600 680 ( t yp . ) ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . )
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 6 tlsh1106 ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 100 1000 10 300 30 3 3 30 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 0 560 600 620 640 680 0.2 0.4 0.6 0.8 1.0 i f = 50 ma ta = 25c 580 660 ( t yp . ) ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . )
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 7 tloh1106 wavelength characteristic relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 1000 10 100 300 30 3 3 30 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 0 540 580 600 620 660 0.2 0.4 0.6 0.8 1.0 i f = 50 ma ta = 25c 560 640 ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . )
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 8 tlyh1106 ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 1 1 10 100 1000 10 100 300 30 3 3 30 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 0 540 580 600 620 660 0.2 0.4 0.6 0.8 1.0 i f = 50 ma ta = 25c 560 640 ( t yp . ) ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . )
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 9 tlgh1106 ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) luminous intensity i v (mcd) i v ? tc wavelength (nm) i f = 50 ma ta = 25c 0 0.4 1.0 0.8 540 0.6 0.2 620 600 580 560 1 10 100 1.4 1.6 1.8 2.0 2.2 2.4 2.6 1 10 100 1000 1 10 100 e)2 -?9sy5d ?

0?sy*w case temperature tc (c) relative luminous intensity i v i v ? i f ( t yp . ) ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . )
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 10 packaging these led devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. the optical characteristics of the devi ces may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopene d within 12 months at the following conditions. temperature: 5 c~30 c humidity: 90% (max) 2. after opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if upon opening, the moisture in dicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the de vices should be baked in taping with reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from sea ling date, which is imprinted on the same side as this label affixed. 4. repeated baking can cause the pee ling strength of the taping to change , then leads to trouble in mounting. furthermore, prevent the devices from being destru cted against static electricity for baking of it. 5. if the packing material of laminate would be broken , the hermeticity would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering ? reflow soldering (example) ? the products are evaluated using above reflow soldering conditions. no additi onal test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh (max) ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s ? if the products need to be performe d by other soldering method (ex. wave soldering), please contact toshiba sales representative. recommended soldering pattern 60~120 s 10 s max 240 c max 4 c/s max 140~160 c 4 c/s max time (s) package surface temperature ( c) temperature profile for pb soldering (example) time (s) package surface temperature ( c) temperature profile for pb-free soldering (example) 150~180 c 4 c/s max 5 s max 260 c max 4 c/s max 230 c 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30~50s max (*) max (*) 1.65 1.15 2.4 unit: mm 1.65 1.0 recommended cu area: anode terminal 24mm 2 min cathode terminal 24mm 2 min
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 11 cleaning when cleaning is required after soldering, tosh iba recommends the following cleaning solvents. it is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, us ing condition and etc. asahi clean ak-225aes : (made by asahi glass) kao clean trough 750h : (made by kao) pine alpha st-100s : (made by arakawa chemical) toshiba technocare : (made by ge toshiba silicones) (frw-17, frw-1, frv-100) precautions when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other cmponents. tape specifications 1. product number format the type of package used for shipment is denote d by a symbol suffix after the product number. the method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard toshiba specifications) (1) tape type: t14 (4-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 + 0.1/ ? 0 p 2 2.0 0.05 e 1.75 0.1 w 8.0 0.3 p 0 4.0 0.1 p 4.0 0.1 t 0.3 0.05 a 0 2.9 0.1 f 3.5 0.05 b 0 3.7 0.1 d 1 1.5 0.1 k 0 2.3 0.1 tlrh1106 (t11) tape type toshiba product no. a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 12 3. reel dimensions unit: mm 4. leader and trailer sections of tape note1: empty trailer section note2: empty leader section 9 0.3 180 + 0 ? 4 60 13 11.4 1.0 2 0.5 44 (note 1) leading part: 190 mm (min) 40 mm or more (note 2) 40 mm or more
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 13 5. packing form (1) packing quantity reel 2,000 pcs carton 10,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) example: tlrh1106 (t11) p/n: toshiba type tlrh1106 addc (t11) q?ty 2,000 pcs lot number key code for tsb 32c 2000 (rank symbol) use under 5-30degc/60%rh within 168h seal date: [[g]]/rohs compatible diffused in ***** *y3804xxxxxxxxxxxxxxxxx* assembled in ***** (2) label location tape feel direction label position label position ? reel ? ? the aluminum package in which the reel is supplied also has the label attached to center of one side.
tl(rh,rmh,sh,oh,yh,gh)1106(t11) 2006-07-07 14 ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality an d reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inhe rent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within s pecified operating ranges as set forth in the most recent toshiba products specific ations. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semicon ductor devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are inte nded for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunc tion or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control in struments, airplane or spaceship instruments, transportation instruments, traffic signa l instruments, combusti on control instruments, medical instruments, all types of safety devices, et c. unintended usage of toshiba products listed in this document shall be made at th e customer?s own risk. ? the products described in this document shall not be used or embedded to any down stream products of which manufacture, use and/or sale are prohibited und er any applicable laws and regulations. ? gaas(gallium arsenide) is used in this product. the dust or vapor is harmful to the human body. do not break, cut, crush or dissolve chemically. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of toshiba or others. restrictions on product use

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